Product Name

BOE Cleaning Equipment

Model

KSBOE

Route Application

TOPCON

Function

Used for the removal of PSG and silicon oxide in PVD processes.

Process Flow

Pickling→Rinse→Pre-dehydration→Drying

Compatible Wafer

182x182mm, compatible with various sizes of 18X 230 silicon wafers.

Cassette Number

4, 6 cassettes

Capacity

182: ≥16000 pcs/hour; 210: ≥12500 pcs/hour

Breakage Rate

Breakage rate <0.01% (Silicon wafer thickness ≥130um)

Power Consumption/ Voltage

295KW/380V 50Hz 3-phase 5-wire system

Features

Supports MES, RFID, and optional online weighing functions; one-key online washing and solution replacement for simple and quick fluid exchange; process tank circulation volume adjustable according to process requirements; compatible with additives from various brands; thorough removal of deposition and thorough cleaning.