Product Name

Mono-Si Alkaline Polishing Equipment

Model

KSSDE

Route Application

TOPCON, HJT, XBC, etc.

Function

Polishing treatment applied to the surface of silicon wafers

Process Flow

Pre-cleaning→Polishing→Post-cleaning→Pickling→Pre-dehydration→Drying

Compatible Wafer

182x182mm, compatible with various sizes of 18X-230 silicon wafers

Cassette Number

4,6 cassettes

Capacity

182: ≥16000 pcs/hour; 210: ≥12500 pcs/hour

Breakage Rate

Breakage rate <0.01% (Silicon wafer thickness ≥130um)

PowerConsumption/ Voltage

310KW/380V 50Hz 3-phase 5-wire system

Features

Supports MES, RFID, and optional online weighing functions; one-key online washing and solution replacement for simple and quick fluid exchange; process circulation volume adjustable according to process requirements; compatible with additives from various brands, achieving excellent polishing results.